F15: Doorknock over Bluetooth
Contents
Grading Criteria
- How well is Software & Hardware Design described?
- How well can this report be used to reproduce this project?
- Code Quality
- Overall Report Quality:
- Software Block Diagrams
- Hardware Block Diagrams
- Schematic Quality
- Quality of technical challenges and solutions adopted.
Project Title
Doorknock over Bluetooth
Abstract
This project is to build a door knock sensor that is mounted on a user's door. Using a vibration sensor, the device will alert the user when someone knocks at their door by sending a notification over Bluetooth to the user's mobile android application, that will be developed to pair with the device.
Objectives & Introduction
Show list of your objectives. This section includes the high level details of your project. You can write about the various sensors or peripherals you used to get your project completed.
Team Members & Responsibilities
- Andrew Herbst
- Sensor interface and UART communication
- Banks Lin
- Android developer and bluetooth communication
Schedule
Show a simple table or figures that show your scheduled as planned before you started working on the project. Then in another table column, write down the actual schedule so that readers can see the planned vs. actual goals. The point of the schedule is for readers to assess how to pace themselves if they are doing a similar project.
| Week# | Date | Task | Status |
|---|---|---|---|
| 1 | 10/23 | Complete Abstract | Completed |
| 2 | 10/30 | Further develop wiki page and purchase/receive components | In Progress |
| 3 | 11/6 | Complete bluetooth and Android communication | In Progress |
| 4 | 11/13 | Have basic response from the sensor | In Progress |
| 5 | 11/20 | Actual communication with bluetooth module | In Progress |
| 6 | 11/27 | Debugging on Android side | In Progress |
| 7 | 12/4 | Finish last debugging and construct hardware | In Progress |
Parts List & Cost
Give a simple list of the cost of your project broken down by components. Do not write long stories here.
- Piezo Element (vibration sensor): $1.50
- JBtek HC-06 Bluetooth Module: $8
- LPC1758 SJ One Board: $80
- Motorola Nexus 6: $600
Total Cost: $689.50
Design & Implementation
The design section can go over your hardware and software design. Organize this section using sub-sections that go over your design and implementation.
Hardware Design
Discuss your hardware design here. Show detailed schematics, and the interface here.
For the Bluetooth module, UART communication was used to send data to the mobile application, alerting the user of a knock on the door.
As shown in Figure 1, the ADC input pin (P0.26) of the SJSU One Board was used to collect the analog signal transmitted by the Piezo vibration sensor. Once the analog signal is collected, it would be converted to a digital value using analog-to-digital conversion methods built into the board. This value would then be measured to determine if the vibration was significant enough to be a knock on the door.
The RXD2 and TXD2 pins on the CPU were used for UART communication with the Bluetooth module. Once a knock was detected by the vibration sensor, a single data byte would be transmitted from the controller to the HC-06 which would be able to transmit the data over Bluetooth to the paired mobile device.
In summary, the pin functionality is briefly described below:
- P0.26 was configured to be the ADC input from the vibration sensor.
- TXD2 was used to send data using the UART2 communication bus to the Bluetooth module.
- RXD2 was used to receive data using the UART2 communication bus from the Bluetooth module.
- 3V3 was used to power the HC-06 by a 3.3V output voltage.
Power Unit:
A 9V battery was used to power the device. However, we could not supply a 9V supply to the LPC1758, as it would damage the baord. Thus, a voltage regulator was designed to supply a 5V output to the SJSU One board. Using two capacitors, a switch, and and LED to indicate power on, as shown in Figure 2, the regulator output a steady 5 volts. The design was completed by soldering the components to perf board and the wire leads were attached to the input ports on the SJSU One board to power the device.
Vibration Sensor:
The device was equipped with a Piezo Vibration sensor to detect the knock. The Piezo sensor operates using the piezoelectric effect, which essentially generates a voltage when the disc on the sensor is touched. This generated voltage can be extremely high, which is why a 1 MOhm resistor was used as a voltage divider so that the output would reach the microcontroller at a safe level. When a vibration is detected, an analog signal is sent to the microcontroller through one of the ADC inputs. The resultant value collected by the microcontroller is 0-4096, as the ADC resolution is 12-bits.
Bluetooth Module:
The JBtek HC-06 Bluetooth module was chosen for this device because it is a widely-used and high-quality device, is compatible with the Android Phone, and has low power-consumption. The device acts as a Bluetooth serial interface module to send data over a wireless connection to the paired mobile application. The device has a built-in 2.4GHz transceiver, enabling it to be paired with nearly any Bluetooth device.
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Hardware Interface
In this section, you can describe how your hardware communicates, such as which BUSes used. You can discuss your driver implementation here, such that the Software Design section is isolated to talk about high level workings rather than inner working of your project.
Software Design
Show your software design. For example, if you are designing an MP3 Player, show the tasks that you are using, and what they are doing at a high level. Do not show the details of the code. For example, do not show exact code, but you may show psuedocode and fragments of code. Keep in mind that you are showing DESIGN of your software, not the inner workings of it.
Bluetooth Task
Sensor Task
Implementation
This section includes implementation, but again, not the details, just the high level. For example, you can list the steps it takes to communicate over a sensor, or the steps needed to write a page of memory onto SPI Flash. You can include sub-sections for each of your component implementation.
Testing & Technical Challenges
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Include sub-sections that list out a problem and solution, such as:
My Issue #1
Discuss the issue and resolution.
Conclusion
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Project Video
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Project Source Code
References
Acknowledgement
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References Used
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Appendix
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